FCBGA

Application: High performance computing,Layers: 8L,Min hole size: 80μm,Core material: BT low CTE,L/S: 20/20μm

FCBGA

800G Optical communication,12L,Min hole size: 60μm,Core material: ABF low Dk/Df,L/S: 15/15μm

WB

Product type: Micro-LED,Layers: 4L,Unit size: 8.45x8.45mm,Core material: HL832NS,Solder mask: PSR-4000ME,Min. L/S: 25/25μm

CSP

Product type: FCCSP for memory,Layers: 4L,Min. hole size: 80μm,Core material: ultra low CTE and high TG,Min. L/S: 20/20μm

FCBGA

Application: GPU,Layers: 10L,Min hole size: 60μm,Core material: ABF low Dk/Df,L/S: 15/15μm

FCBGA

Product type: FCBGA for CUP,Layers: 14L,Min hole size: 60μm,Core material: ABF+E705G,Min. L/S: 12/12μm

Al2O3 Substrate

High thermal conductivity, excellent insulation, very low coefficient of expansion, low dielectric constant and dielectric loss, chemical resistance

Al2O3 Substrate

High thermal conductivity, excellent insulation, very low coefficient of expansion, low dielectric constant and dielectric loss, chemical resistance

AIN Substrate

Ultra-high thermal conductivity (170-220W/m.K), excellent insulation, extremely low expansion coefficient, low dielectric constant and dielectric loss, resistance to chemical corrosion.

Al2O3 Substrate

High thermal conductivity, excellent insulation, very low coefficient of expansion, low dielectric constant and dielectric loss, chemical resistance

14L Rigid-flex

14L, rigid-flex, Air Gap design, applied in the field of large medical equipment.

18L Rigdi-flex

18L rigid-flex, 2(rigid)+14(flex)+2(rigid), Air Gap design,applied in the field of high-end communication

Multilayers HDI

Up to 32 layers, and the structure can realize any layer interconnection, which is widely used in mobile phones, digital cameras, notebook, automotive electronics and other digital products.

Heavy Copper

The base copper can reach 3OZ, and the finished copper thickness can reach 12OZ. It is widely used in microwave, aerospace, satellite communication, network base station, hybrid integrated circuit, power high-power circuit and other high-tech fields.