• 14L, rigid-flex
• Air Gap design
• applied in the field of
• large medical equipment
14L Rigid-Flex is a multilayer printed circuit board that integrates the characteristics of Rigid circuit boards and flexible circuit boards, and has the following features and applications:
Structural characteristics
The 14-layer structure means that this rigid-flex board has a high wiring density and complex circuit functions, which can meet the circuit performance requirements of high-end electronic products.
Rigid-flex combination: It combines the advantages of rigid and flexible plates, providing stable support while also enabling bending and folding, thus meeting the installation requirements of different shapes and Spaces.
Material selection: For rigid areas, base materials such as FR-4 may be adopted, while for flexible areas, flexible materials such as polyimide (PI) are used to ensure good bending performance and electrical properties.
• Application: 800G Optical communication
• Layers: 12L
• Min hole size: 60μm
• Core material: ABF low Dk/Df
• L/S: 15/15μm
• Application: GPU
• Layers: 10L
• Min hole size: 60μm
• Core material: ABF low Dk/Df
• L/S: 15/15μm
• Product type: FCCSP for memory
• Layers: 4L
• Min. hole size: 80μm
• Core material: ultra low CTE and high TG
• Min. L/S: 20/20μm
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Circuit-Chip provides advanced semiconductor substrates, packaging and engineering support for high-performance electronic applications. Our capabilities cover IC substrate design and fabrication, advanced packaging, simulation, testing, reliability support and selected high-density interconnect solutions for applications such as optical communication, AI computing, RF and industrial electronics.
