• High thermal conductivity
• Excellent insulation
• Very low coefficient of expansion
• Low dielectric constant and dielectric loss
• Chemical resistance
Al₂O₃ substrate (alumina substrate) is a ceramic substrate material with alumina (Al₂O₃) as its main component. Due to its excellent physical, chemical and electrical properties, it is widely used in the fields of electronics, optoelectronics, machinery, chemical engineering, etc.
Material properties
High hardness and wear resistance: Alumina is a high-hardness ceramic material with a Mohs hardness of up to 9, second only to diamond, and it has excellent wear resistance and scratch resistance.
High insulation: Alumina has an extremely high resistivity (typically greater than 10¹⁴ Ω·cm), making it an ideal electrical insulating material and suitable for high-voltage and high-frequency electronic devices.
High thermal conductivity: The thermal conductivity of pure alumina is approximately 20-30 W/(m·K), which can effectively dissipate heat and is suitable for high-power electronic devices.
Chemical stability: Alumina has excellent chemical stability against most acids, bases and organic solvents, making it suitable for applications in harsh environments.
High-temperature stability: The melting point of alumina is as high as 2072°C, which enables it to maintain structural stability in high-temperature environments and is suitable for high-temperature electronic devices.
Low dielectric constant and low dielectric loss: The dielectric constant of alumina is relatively low (usually 9-10), and its dielectric loss is small, making it suitable for high-frequency circuits and microwave devices.
• Application: 800G Optical communication
• Layers: 12L
• Min hole size: 60μm
• Core material: ABF low Dk/Df
• L/S: 15/15μm
• Application: GPU
• Layers: 10L
• Min hole size: 60μm
• Core material: ABF low Dk/Df
• L/S: 15/15μm
• Product type: FCCSP for memory
• Layers: 4L
• Min. hole size: 80μm
• Core material: ultra low CTE and high TG
• Min. L/S: 20/20μm
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