SIP Design & Process Capabilities,Wafer thinning,scribing capability, Die stack & Bonding
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WLP Key Technology: Redistribution Layers(RDL):5um line width RDL can achieve high yield currently……
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Circuit-Chip provides advanced semiconductor substrates, packaging and engineering support for high-performance electronic applications. Our capabilities cover IC substrate design and fabrication, advanced packaging, simulation, testing, reliability support and selected high-density interconnect solutions for applications such as optical communication, AI computing, RF and industrial electronics.