Multilayers HDI

Multilayers HDI (High-density Interconnect Multilayer Board) is an advanced printed circuit board (PCB) technology in the field of modern electronic manufacturing. It combines the high-density routing capability of multilayers and the high-precision interconnect characteristics of HDI technology, and is widely used in electronic products with extremely high requirements for circuit performance and space utilization.

Technical characteristics

High-density cabling: Through multi-layer stacking and micro-hole techniques (such as laser drilling), finer wire widths/wire spacings (typically less than 75μm) and smaller hole diameters (typically less than 150μm) are achieved, significantly enhancing the cabling density.

Multi-layer structure: It usually contains more than 4 layers, and can even reach 20 or more layers. Through lamination processes, multiple conductive and insulating layers are alternately stacked to achieve complex circuit functions.

Micro-hole interconnection: By adopting various interconnection methods such as Blind Via, Buried Via and Through Via, the signal transmission path is optimized and signal interference is reduced.

Thin dielectric layer: The thickness of the dielectric between layers is usually between 50μm and 100μm, further reducing the size of the circuit board and improving space utilization.