SOP

The SOP (Small Outline Package) chip is a common form of surface mount integrated circuit packaging. The following is an introduction from aspects such as packaging structure, technical characteristics, application fields, variant types, and test requirements:

Packaging structure

Pin distribution: The pins of the SOP chip are distributed on both sides of the chip, presenting a seagull wing shape (L-shaped) or J-shaped (SOJ package).

Encapsulation material: Plastic is usually used as the encapsulation material, and sometimes ceramic is also used.

Package height: The package height is as low as 1.75mm, compact in size and light in weight.

Technical characteristics

Pin count and pitch: The pin count is generally between 8 and 64, and the pin pitch is usually 0.65mm, 0.8mm or 1.27mm.

High integration: SOP packaging can achieve the integration of high-Q circuits and high-power modules through multi-layer three-dimensional structures such as LTCC process, and the system integration is high.

Low cost: Due to the mature packaging process, the production cost is relatively low.

Excellent electrical performance: It has excellent thermal and electrical performance and supports the installation of high-density circuit boards.