• Product type: Micro-LED
• Layers: 4L
• Unit size: 8.45x8.45mm
• Core material: HL832NS
• Solder mask: PSR-4000ME
• Min. L/S: 25/25μm
Micro-led (Micro light-Emitting Diode) is a new type of display technology. Its core lies in miniaturizing the LED structure and integrating it at high density to form an array of self-luminous pixel units.
Each pixel of Micro-LED is composed of red, green and blue sub-pixels, and each sub-pixel is an independently controlled LED unit. Its working principle is based on the electroluminescence effect of semiconductor materials: when current passes through the P-N junction, electrons and holes recombine to release energy, which is emitted in the form of photons. Micro-LED reduces the size of traditional leds to the level of 1-100 microns. Through high-precision mass transfer technology, it batch-transfers tiny LED chips to driver substrates (such as TFT or CMOS substrates) to form high-resolution display panels.
• Application: 800G Optical communication
• Layers: 12L
• Min hole size: 60μm
• Core material: ABF low Dk/Df
• L/S: 15/15μm
• Application: GPU
• Layers: 10L
• Min hole size: 60μm
• Core material: ABF low Dk/Df
• L/S: 15/15μm
• Product type: FCCSP for memory
• Layers: 4L
• Min. hole size: 80μm
• Core material: ultra low CTE and high TG
• Min. L/S: 20/20μm
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