• 18L rigid-flex
• 2(rigid)+14(flex)+2(rigid)
• Air Gap design
• Applied in the field of high-end communication
18L Rigid-flex may refer to a Rigid-flex PCB with an 18-layer structure. The Rigid-flex PCB is a special type of printed circuit board that combines the advantages of both Rigid and flexible boards. It has the support and stability of Rigid boards as well as the flexibility and foldability of flexible boards. This structure enables rigid-flex composite boards to have wide applications in electronic products that require three-dimensional assembly and spatial optimization.
Characteristics of 18L Rigid-flex
The 18-layer structure means that this rigid-flex board has a higher wiring density and more complex circuit functions, which can meet the circuit performance requirements of high-end electronic products.
Rigid-flex combination: It combines the characteristics of rigid plates and flexible plates, providing stable support while also enabling bending and folding, thus meeting the installation requirements of different shapes and Spaces.
Space optimization: Through the design of combining rigidity and flexibility, the assembly size and weight of electronic products can be effectively reduced, achieving miniaturization and lightweighting of the products.
High reliability: During the manufacturing process of rigid-flex composite plates, strict process control and quality inspection are required to ensure their high reliability and stability.
• Application: 800G Optical communication
• Layers: 12L
• Min hole size: 60μm
• Core material: ABF low Dk/Df
• L/S: 15/15μm
• Application: GPU
• Layers: 10L
• Min hole size: 60μm
• Core material: ABF low Dk/Df
• L/S: 15/15μm
• Product type: FCCSP for memory
• Layers: 4L
• Min. hole size: 80μm
• Core material: ultra low CTE and high TG
• Min. L/S: 20/20μm
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