TSMC Accelerates Development of CoPoS Packaging Technology to Meet AI Chip Demand

Taiwan Semiconductor Manufacturing Company (TSMC) is advancing its next-generation advanced packaging technology, CoPoS ...

SpaceX Plans Texas-Based Chip Packaging Facility with FOPLP Technology

June 2025 – Texas, USA — SpaceX is making strategic moves toward semiconductor vertical integration by preparing to ente...

STMicroelectronics to Cut 5,000 Jobs in Global Restructuring Strategy

June 5, 2025 – Geneva, Switzerland — European semiconductor leader STMicroelectronics has announced a major restructurin...

Forced Uyghur Labor Allegedly Used in Chinese PCB Factories Supplying Global Electronics Brands

On May 29, Germany’s Der Spiegel, The New York Times, and the UK’s Bureau of Investigative Journalism (TBIJ) jointly rel...

Samsung to Adopt Glass Interposers for AI Chips by 2028-chip packaging

Samsung Electronics plans to adopt glass interposers in semiconductor manufacturing starting in 2028, aiming to boost AI...