ASE Boosts CapEx to Meet Soaring AI Chip Demand

ASE Technology Holding, the world’s largest provider of chip assembly and testing services, announced plans to raise its...

NVIDIA Eyes CoWoP Packaging for Next-Gen AI GPUs

CoWoS (Chip-on-Wafer-on-Substrate) has long been the standard for AI and HPC chips, powering industry leaders like NVIDI...

Vietnam to Launch $69M Semiconductor Packaging Lab in Da Nang by 2026

Da Nang, Vietnam – July 28, 2025 – Vietnam’s Ministry of Science and Technology, in partnership with the Da Nang People’...

Intel Unveils Major Restructuring: 21,000 Layoffs and a Shift in Foundry, AI, and CPU Strategy

Santa Clara, CA – July 25, 2025 – Intel CEO Lip-Bu Tan has announced one of the company’s most sweeping transformations ...

SK keyfoundry and LB Semicon Co-Develop Automotive-Grade Direct RDL Packaging

July 2025 – SK keyfoundry and LB Semicon have successfully co-developed and completed reliability testing for Direct Red...

SHENMAO Expands into Advanced IC Packaging with PMTC Acquisition

San Jose, California – July 2025 – SHENMAO America, Inc. has officially acquired Profound Material Technology Co., Ltd. ...

LG Innotek Unveils Copper Post Technology for Smaller, Cooler RF-SiP Substrates

June 25, 2025，LG Innotek (KRX: 011070) has announced the successful development of the world’s first Copper Post (Cu-Pos...

Smartkem and Manz Asia Collaborate on AI Chip Packaging Innovation

Smartkem and Manz Asia Collaborate on AI Chip Packaging InnovationManchester, England – July 9, 2025 – Smartkem (Nasdaq:...

TSMC Flies Arizona Chips to Taiwan for Packaging, Exposing U.S. Supply Chain Gaps

The United States’ efforts toward semiconductor self-sufficiency continue to face critical challenges. According to a ne...

Aptos Technology Files for Bankruptcy Amid Mounting Losses in NAND Flash Packaging and SiP Assembly

On June 24, Taiwan-listed company TMC (2338.TW) announced that its indirectly held subsidiary Aptos Technology, in which...