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LG Innotek Unveils Copper Post Technology for Smaller, Cooler RF-SiP Substrates
June 25, 2025,LG Innotek (KRX: 011070) has announced the successful development of the world’s first Copper Post (Cu-Pos...
Jul 10,2025 -
Smartkem and Manz Asia Collaborate on AI Chip Packaging Innovation
Smartkem and Manz Asia Collaborate on AI Chip Packaging InnovationManchester, England – July 9, 2025 – Smartkem (Nasdaq:...
Jul 09,2025 -
TSMC Flies Arizona Chips to Taiwan for Packaging, Exposing U.S. Supply Chain Gaps
The United States’ efforts toward semiconductor self-sufficiency continue to face critical challenges. According to a ne...
Jul 04,2025 -
Aptos Technology Files for Bankruptcy Amid Mounting Losses in NAND Flash Packaging and SiP Assembly
On June 24, Taiwan-listed company TMC (2338.TW) announced that its indirectly held subsidiary Aptos Technology, in which...
Jul 01,2025 -
ASE Technology Weighs US Expansion in Advanced Chip Packaging Amid Tariff Uncertainty
ASE Technology Holding Inc., the world’s largest semiconductor packaging and testing provider, said on June 25 it is car...
Jun 27,2025 -
SK hynix Expands Chip Packaging Capacity with New Back-End Plant in South Korea | Advanced Semiconductor Packaging News
SK hynix Inc. is accelerating its presence in the advanced chip packaging sector with a newly planned semiconductor back...
Jun 24,2025 -
Huawei’s Quad-Chiplet Patent for Ascend 910D Signals Advanced AI Packaging Ambitions
Backed by founder Ren Zhengfei’s belief in advanced packaging as a means to overcome current semiconductor restrictions,...
Jun 18,2025 -
Taiwan Blacklists Huawei and SMIC, Tightening Controls on AI Chip Technology
Taiwan has formally blacklisted Huawei Technologies and Semiconductor Manufacturing International Corporation (SMIC), ma...
Jun 17,2025 -
TSMC Accelerates Development of CoPoS Packaging Technology to Meet AI Chip Demand
Taiwan Semiconductor Manufacturing Company (TSMC) is advancing its next-generation advanced packaging technology, CoPoS ...
Jun 12,2025 -
SpaceX Plans Texas-Based Chip Packaging Facility with FOPLP Technology
June 2025 – Texas, USA — SpaceX is making strategic moves toward semiconductor vertical integration by preparing to ente...
Jun 07,2025