Smartkem and Manz Asia Collaborate on AI Chip Packaging Innovation
Jul 09,2025
Smartkem and Manz Asia Collaborate on AI Chip Packaging Innovation
Manchester, England – July 9, 2025 – Smartkem (Nasdaq: SMTK), a leader in organic semiconductor materials, today announced a preliminary Joint Development Agreement (JDA) with Manz Asia, a pioneering equipment provider for advanced semiconductor packaging. The collaboration aims to co-develop cutting-edge dielectric ink solutions tailored for AI chip packaging, including 12-inch wafer-level and panel-level packaging applications.
“This agreement marks an exciting step forward in our long-standing partnership with Manz Asia,” said Ian Jenks, Chairman and CEO of Smartkem. “At SEMICON SEA 2025, we demonstrated an innovative inkjet metallization process for chip packaging. Now, we’re aiming to build scalable, high-performance solutions to overcome bottlenecks in advanced AI and computing chip packaging. Our unique semiconductor materials combined with Manz’s inkjet precision could pave the way for next-generation 12-inch wafer packaging and even large-area panel packaging—boosting yield while lowering per-chip costs. This is critical as data centers deploy thousands of AI accelerators.”
Robert Lin, General Manager at Manz Asia, added:“By uniting Smartkem’s expertise in semiconductor material science with our engineering capabilities in equipment manufacturing, we aim to accelerate industrial adoption of dielectric ink technology. This innovation supports higher resolution, better scalability, and more reliable back-end-of-line (BEOL) processes, including top metal insulation and RDL patterning, which are crucial for complex chip architectures.”
The push for AI computing is driving a demand for more efficient and cost-effective packaging methods. While traditional wafer-based methods face physical limits, panel-level packaging offers several advantages—greater chip density, faster interconnects, enhanced thermal performance, and more sustainable production.
This preliminary JDA is currently non-binding, and while both parties are optimistic, there is no guarantee as to when or if a definitive agreement will be executed.
About Smartkem
Smartkem is redefining electronics with its proprietary TRUFLEX® organic semiconductor platform, enabling low-temperature, printable transistors for flexible displays and chip packaging. The technology supports applications in MicroLED, AMOLED, sensors, logic circuits, and AI chip packaging. Smartkem operates out of Manchester, UK, with prototyping facilities at CPI Sedgefield and field application support in Hsinchu, Taiwan.
About Manz Asia
Manz Asia delivers state-of-the-art equipment solutions for semiconductor packaging within the CoPoS (CoWoS Panelization) framework. Its technologies span wet chemistry, plating, digital printing, and RDL automation, serving applications such as FOPLP, Through Glass Via (TGV), and IC substrate manufacturing.
