SHENMAO Expands into Advanced IC Packaging with PMTC Acquisition

San Jose, California – July 2025 – SHENMAO America, Inc. has officially acquired Profound Material Technology Co., Ltd. (PMTC), a leading Taiwan-based manufacturer of high-performance solder balls used in advanced semiconductor packaging. This strategic move marks a major milestone in SHENMAO’s global expansion and further strengthens its presence in the IC substrate and packaging materials market.

Founded in 2004, PMTC is recognized worldwide for its proprietary solder alloys, tailored for cutting-edge formats such as FCCSP (Flip Chip Chip Scale Packaging) and WLCSP (Wafer Level Chip Scale Packaging). Its solder balls are trusted by top-tier IC design houses and OSATs (Outsourced Semiconductor Assembly and Test) for delivering exceptional ductility, drop resistance, and thermal fatigue durability.

“The addition of PMTC deepens our access to the advanced packaging supply chain,” said Kelvin Li, General Manager of SHENMAO Group. “It adds not only new capacity and technical expertise, but also a robust R&D foundation in solder material innovation. Together, we aim to deliver even greater value to customers in next-generation semiconductor applications.”

Focus on Green Manufacturing: PMTC's New Low-Temp E4 Solder Alloy

As part of its commitment to eco-conscious and high-reliability materials, PMTC has developed a next-generation low-temperature solder alloy, E4 (Sn47.875Bi + Ag + Cu + In + Ni). This patented alloy addresses the growing need for temperature-sensitive assembly and carbon-reducing production environments, especially in sectors like automotive electronics, consumer devices, and high-density IC packaging.

✅ Key Advantages of the E4 Alloy:

• High Reliability: Alloyed with Cu, Ni, and In to improve creep resistance, mechanical strength, and thermal cycling performance.

• Controlled IMC Formation: Forms stable (Cu,Ni)₆(Sn,In)₅ compounds, enhancing joint strength and long-term stability.

• Superior Thermal Cycling Life: Outperforms traditional Sn42Bi58 and Sn42Bi57Ag1 alloys in fatigue resistance.

• Optimized Element Distribution: Bismuth remains concentrated in the solder core, while reinforcing elements distribute evenly at the joint interface for robust connectivity.

• Energy-Efficient Reflow: With a reflow peak temperature ≤180°C, E4 significantly reduces energy consumption while protecting thermally sensitive components.

This breakthrough alloy is ready for production-scale deployment in flexible PCBs, BGA packaging, and system-in-package (SiP) modules, offering a reliable and sustainable alternative to traditional high-temperature solders.

About SHENMAO Group
SHENMAO is a global leader in solder materials, offering comprehensive solutions for SMT, semiconductor packaging, and PCB assembly. With a commitment to innovation, reliability, and sustainability, SHENMAO continues to support the rapidly evolving needs of the electronics industry.