NVIDIA Eyes CoWoP Packaging for Next-Gen AI GPUs
Aug 01,2025
CoWoS (Chip-on-Wafer-on-Substrate) has long been the standard for AI and HPC chips, powering industry leaders like NVIDIA and AMD. With its mature supply chain and robust ecosystem, CoWoS remains reliable—but NVIDIA is now exploring a new frontier: CoWoP (Chip-on-Wafer-on-Platform).
Unlike CoWoS, CoWoP eliminates the package substrate, connecting the interposer directly to the motherboard. This shift brings several performance and cost advantages:
Improved Signal Integrity (SI) by removing substrate losses
Better Power Integrity (PI) with VR units closer to the GPU
Enhanced Thermal Performance via direct die contact and lidless design
Lower Costs (no package, no lid)
Reduced Warpage via lower PCB thermal expansion
Extended NVLINK reach and bandwidth
Alignment with long-term dielet-based architecture
These benefits could significantly boost next-gen GPU efficiency and scalability.
NVIDIA's CoWoP Roadmap
According to leaked plans, NVIDIA began initial CoWoP testing in July 2025 using a dummy GB100 GPU/HBM unit (110x110 mm) to evaluate process flow. In August 2025, a functional GB100 CoWoP test will follow, focusing on electrical and structural integrity, thermal performance, and NVLINK throughput. Testing will be conducted on an e6540 board with dual GB102 GPUs.
In 2026, NVIDIA plans to trial GR100 "Rubin" chips in a CoWoP configuration with SXM8 form factor, serving as a pipeline for the production-grade GR150 Rubin GPU, expected in 2027.
However, CoWoP won’t replace CoWoS entirely. Both packaging types will coexist, depending on product needs and ecosystem readiness.
Challenges Ahead
While CoWoP promises technical gains, the transition costs are significant. It requires a new supply chain, motherboard redesigns, and manufacturing process changes—posing risks in scalability and cost control.
Morgan Stanley has also reportedly said that there are little chances of NVIDIA adopting CoWoP for its next-generation GPUs, and several investor firms seem to be backing that. Though it all depends on the market trends and supply/demand factors. It will be a few years before Rubin comes to market, and only then will we be able to see if CoWoP is used; the good 'ol CoWoS is still rocking on Rubin.
