SK keyfoundry and LB Semicon Co-Develop Automotive-Grade Direct RDL Packaging
Jul 22,2025
July 2025 – SK keyfoundry and LB Semicon have successfully co-developed and completed reliability testing for Direct Redistribution Layer (RDL) technology on 8-inch wafers, marking a significant milestone in next-generation semiconductor packaging, particularly for automotive applications.
What is Direct RDL?
RDL (Redistribution Layer) is a key packaging technology that involves adding metal interconnects and insulating layers on top of a semiconductor chip, enabling rerouted electrical pathways. It is widely used in Wafer-Level Packaging (WLP) and Fan-Out Wafer-Level Packaging (FOWLP) to improve I/O density and minimize signal interference.
SK keyfoundry and LB Semicon's Direct RDL solution is engineered to support high-current power semiconductors, achieving:
15 μm thick metal wiring
Up to 70% chip area wiring density
Optimized layout for mobile, industrial, and automotive use
Most notably, this Direct RDL meets the stringent Auto Grade 1 criteria under the AEC-Q100 international standard, ensuring reliable performance across –40℃ to +125℃, ideal for harsh automotive environments—a benchmark many competing technologies have yet to meet.
In addition to its technical robustness, SK keyfoundry now provides a full Design Guide and Process Development Kit (PDK), enabling chip designers to build smaller, more efficient, and cost-effective packages tailored to customer-specific applications.
Focus on Automotive & Power Semiconductor Packaging
Thanks to the integration of LB Semicon’s backend processing expertise with SK keyfoundry’s advanced foundry capabilities, the two companies have:
Significantly reduced development time
Optimized wafer-level Direct RDL formation
Enhanced manufacturing yield and production scalability
“This achievement is a key milestone for both companies,” said Namseog Kim, CEO of LB Semicon. “It reflects our technological competitiveness and shared commitment to the next generation of reliable semiconductor packaging.”
“Our collaboration with LB Semicon demonstrates the successful fusion of foundry and packaging technologies,” added Derek D. Lee, CEO of SK keyfoundry. “We aim to become a top-tier foundry delivering high-reliability semiconductor solutions globally.”
This collaboration positions both companies at the forefront of automotive-grade RDL packaging, addressing the increasing demands for compact, high-performance, and cost-efficient chip packaging solutions in the era of EVs, ADAS, and AI computing.
