Samsung Electronics plans to adopt glass interposers in semiconductor manufacturing starting in 2028, aiming to boost AI...
The SOP (Small Outline Package) chip is a common form of surface mount integrated circuit packaging. The following is an...
QFN (Quad Flat No-lead Package), namely square flat no-lead package, is a technology widely used in the field of integra...
WBBGA (Wire Bond Ball Grid Array, wire bond chip ball grid array) is a traditional and mature packaging process, and its...
FCCSP (Flip Chip Chip Scale Package) is an advanced microelectronic packaging technology and has the following character...
FCBGA packaging adopts flip-chip technology, that is, the circuit surface of the chip faces down and is directly electri...
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Our business scope includes IC substrate design and simulation, IC substrate manufacturing, IC packaging and testing, as well as comprehensive hardware assembly services(PCB & PCBA).
