Samsung to Adopt Glass Interposers for AI Chips by 2028-chip packaging

Samsung Electronics plans to adopt glass interposers in semiconductor manufacturing starting in 2028, aiming to boost AI chip performance, cut production costs, and gain a competitive edge.

Interposers are critical in 2.5D chip packaging, particularly for AI chips where GPUs interface with high-bandwidth memory (HBM). While silicon interposers offer strong performance, they are costly. Glass interposers provide greater precision, better dimensional stability, and lower cost.

Samsung is developing glass interposers under 100×100 mm, enabling faster prototyping and shorter time to market. The company is also leveraging panel-level packaging (PLP) at its Cheonan facility, using square panels instead of traditional wafers.

This shift supports Samsung’s AI Integrated Solution strategy, which combines foundry, HBM, and advanced packaging. The new approach is expected to strengthen Samsung’s AI market position and drive external orders and revenue growth.