Wafer-Level Ball Grid Array (WLBGA) is an advanced integrated circuit Packaging technology that combines the characteristics of Wafer-Level packaging (WLP) and Ball Grid Array (BGA). Aiming to achieve high-density, high-performance and miniaturized packaging solutions.
Miniaturization: The package size is close to that of the chip, making it suitable for applications with strict space requirements.
High performance: It shortens the signal transmission path, reduces parasitic effects, and enhances electrical performance.
High-density I/O: The ball grid array offers more I/O connection points and is suitable for complex and high-function chips.
Low cost: The wafer-level packaging process reduces packaging steps and lowers production costs.
High reliability: Spherical solder balls provide excellent mechanical and electrical connections, enhancing the reliability of the package.
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Circuit-Chip provides advanced semiconductor substrates, packaging and engineering support for high-performance electronic applications. Our capabilities cover IC substrate design and fabrication, advanced packaging, simulation, testing, reliability support and selected high-density interconnect solutions for applications such as optical communication, AI computing, RF and industrial electronics.
