Whether it is chip design, package design or PCB design, the internal signal interconnection and power supply network are very complex. These interconnections have certain parasitic resistance, inductance and capacitance effects. It is precisely because of the existence of these parasitic effects that the signal is in the During transmission, error transmission is prone to occur.
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Circuit-Chip provides advanced semiconductor substrates, packaging and engineering support for high-performance electronic applications. Our capabilities cover IC substrate design and fabrication, advanced packaging, simulation, testing, reliability support and selected high-density interconnect solutions for applications such as optical communication, AI computing, RF and industrial electronics.
